BAT54CV 查看數據表（PDF） - NXP Semiconductors.

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BAT54CV

Two Schottky barrier double diodes

NXP Semiconductors. 

NXP Semiconductors

BAT54CV

Two Schottky barrier double diodes

10. Packing information

Table 8. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number

Package Description

BAT54CV

SOT666 4 mm pitch, 8 mm tape and reel

[1] For further information and the availability of packing methods, see Section 14.

11. Soldering

Packing quantity

4 000

-115

2.75

2.45

2.1

1.6

0.538

2 1.7 1.075

0.55

(2×)

0.4

(6×) 0.25 0.3

(2×) (2×)

1.7

0.45

0.6

(4×)

(2×)

0.5

0.65

(4×)

(2×)

0.325 0.375

(4×) (4×)

Reflow soldering is the only recommended soldering method.

Fig 5. Reflow soldering footprint BAT54CV (SOT666)

solder lands

placement area

solder paste

occupied area

Dimensions in mm

sot666_fr

BAT54CV

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 15 November 2010

© NXP B.V. 2010. All rights reserved.

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