BD2812GU 查看數據表（PDF） - ROHM Semiconductor
零件编号
产品描述 (功能)
生产厂家
BD2812GU Datasheet PDF : 5 Pages
| |||
● Block Diagram
4/4
●Pin Functions
VBATCP
VBAT2
VBAT1
VIO
RESETB
SCL
SDA
RGB1CNT
RGB2CNT
ADDSEL
RGBISET
Charge Pump
Charge Pump
Mode Control
x1 / x1.5 / x2
OVP
LED port voltage Feedback
Slope
Control
(RGB1)
Level I2C interface
I/O
Shift Digital Control
Slope
Control
(RGB2)
IREF
VREF
TSD
CLKIO
VOUT
VOUTM
R1LED
G1LED
B1LED
R2LED
G2LED
B2LED
RGBGND
CLKIO
PIN
PIN NAME
PIN
PIN NAME
B6
VBATCP
C5
C1P
F2
VBAT1
A5
C2N
C1
VBAT2
C6
C2P
A1
T1
D6
VOUT
A6
T2
D5
VOUTM
F6
T3
E2
RGBISET
F1
T4
E6
R1LED
A2
VIO
E5
G1LED
A3
RESETB
F5
B1LED
B3
SDA
E4
R2LED
B2
SCL
E3
G2LED
A4
CPGND
F3
B2LED
E1
GND1
D2
RGB1CNT
B1
GND2
D1
RGB2CNT
F4
RGBGND
B4
ADDSEL
B5
C1N
C2
CLKIO
● Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to
identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to
take physical safety measures including the use of fuses, etc.
(2) Power supply and ground line
Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention to the interference by common impedance of
layout pattern when there are plural power supplies and ground lines. Especially, when there are ground pattern for small signal and ground pattern for large
current included the external circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor between the power supply
and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the
occurrence of capacity dropout at a low temperature, thus determining the constant.
(3) Ground voltage
Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no pins are at a potential lower
than the ground voltage including an actual electric transient.
(4) Short circuit between pins and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit
occurs due to foreign matters entering between pins or between the pin and the power supply or the ground pin, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input pins
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit
operation, thus resulting in a malfunction and then breakdown of the input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins
a voltage lower than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input pins when no power supply voltage is
applied to the IC. In addition, even if the power supply voltage is applied, apply to the input pins a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and
changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher, the thermal shutdown circuit operates
and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection
or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use.
(10) LDO
Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited because it has the possibility that an operation
becomes unstable.
(11) About the pin for the test, the un-use pin
Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a function manual and an application notebook.
And, as for the pin that doesn't specially have an explanation, ask our company person in charge.
(12) About the rush current
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays. Therefore,
give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of wiring.
(13) About the function description or application note or more.
The function description and the application notebook are the design materials to design a set. So, the contents of the materials aren't always guaranteed. Please
design application by having fully examination and evaluation include the external elements.
REV. A
Share Link: 