BD9207FPS 查看數據表（PDF） - ROHM Semiconductor
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BD9207FPS Datasheet PDF : 12 Pages
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BD9207FPS
● Heat transfer characteristic
Technical Note
①IC unit
②2 layers substrate(area of substrate back copper foil:15 mm×15mm)
③2 layers substrate(area of substrate back copper foil:70 mm×70mm)
（W）
5
4
③3.50W
3
②1.85W
2
①0.80W
1
0
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE [Ta]
（℃）
● I/O terminal equivalent circuit diagram
1Pin,FIN (VCC, GND)
2pin (OUT)
VCC
VCC
OUT
GND
4pin (INV)
VCC
INV
5pin (STBY)
VCC
STBY
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8/11
2009.07 - Rev.A
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