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BF1212 查看數據表(PDF) - NXP Semiconductors.

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产品描述 (功能)
生产厂家
BF1212
NXP
NXP Semiconductors. NXP
BF1212 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
NXP Semiconductors
N-channel dual-gate MOS-FETs
Product specification
BF1212; BF1212R; BF1212WR
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling.
ORDERING INFORMATION
TYPE NUMBER
BF1212
BF1212R
BF1212WR
NAME
PACKAGE
DESCRIPTION
plastic surface mounted package; 4 leads
plastic surface mounted package; reverse pinning; 4 leads
plastic surface mounted package; reverse pinning; 4 leads
VERSION
SOT143B
SOT143R
SOT343R
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
VDS
drain-source voltage
ID
drain current (DC)
IG1
gate 1 current
IG2
gate 2 current
Ptot
total power dissipation
BF1212; BF1212R
BF1212WR
Tstg
storage temperature
Tj
junction temperature
CONDITIONS
Ts 116 C; note 1
Ts 122 C; note 1
Note
1. Ts is the temperature of the soldering point of the source lead.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-s
thermal resistance from junction to soldering point
BF1212; BF1212R
BF1212WR
MIN.
MAX.
6
30
10
10
UNIT
V
mA
mA
mA
180
mW
180
mW
65
+150
C
150
C
VALUE
185
155
UNIT
K/W
K/W
2003 Nov 14
3

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