BLF647P 查看數據表（PDF） - NXP Semiconductors.
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BLF647P Datasheet PDF : 14 Pages
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NXP Semiconductors
BLF647P
Broadband power LDMOS transistor
Table 9. List of components
Printed-Circuit Board (PCB): RF 35; r = 3.5 F/m; thickness = 0.765 mm; thickness copper plating = 35 m.
See Figure 1 and Figure 2.
Component Description
Value
Remarks
C1, C2, C3 multilayer ceramic chip capacitor 68 pF
[1]
C4, C5
multilayer ceramic chip capacitor 4.7 F, 50 V
C6
multilayer ceramic chip capacitor 2.4 pF
[2]
C7, C8
multilayer ceramic chip capacitor 4.7 pF
[1]
C11
multilayer ceramic chip capacitor 3.3 pF
[3]
C12
multilayer ceramic chip capacitor 2.4 pF
[3]
C13, C14
multilayer ceramic chip capacitor 3.3 pF
[3]
C15, C16
multilayer ceramic chip capacitor 1.2 pF
[3]
C17, C18
multilayer ceramic chip capacitor 4.7 F, 50 V
C19, C20, C21 multilayer ceramic chip capacitor 220 pF
[3]
C22, C23
electrolytic capacitor
470 F, 63 V
L1
microstrip
(L W) 4 mm 1.7 mm
L2, L3
microstrip
(L W) 22.5 mm 1.6 mm
L4, L5
microstrip
(L W) 16.5 mm 15 mm
L11, L12
microstrip
(L W) 8.5 mm 15 mm
L13, L14
microstrip
(L W) 26 mm 4.2 mm
L15
microstrip
(L W) 4 mm 1.7 mm
R1, R2
SMD resistor
5.6
SMD1206
R3, R4
WIRE resistor
100
T1
semi rigid coax
25 , 40 mm UT-090C-25
T2
semi rigid coax
25 , 40 mm UT-141C-25
[1] American Technical Ceramics type 800A or capacitor of same quality.
[2] American Technical Ceramics type 100A or capacitor of same quality.
[3] American Technical Ceramics type 800B or capacitor of same quality.
BLF647P
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 April 2013
© NXP B.V. 2013. All rights reserved.
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