BP5307 查看數據表（PDF） - ROHM Semiconductor
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BP5307 Datasheet PDF : 4 Pages
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Communication ICs
FRecommended pad dimensions
BP5307
FOperation notes
The soldering used inside the unit is eguivalent to H63
solder, so it will remelt during reflow. Be sure not to sub-
ject the unit to any vibrations when passing through the
reflow furnace.
FExternal dimensions (Units: mm)
586
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