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E6325 查看數據表(PDF) - Siemens AG

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E6325 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
BSS 88
Maximum Ratings
Parameter
Chip or operating temperature
Storage temperature
Thermal resistance, chip to ambient air 1)
DIN humidity category, DIN 40 040
IEC climatic category, DIN IEC 68-1
Symbol
Tj
Tstg
RthJA
Values
Unit
-55 ... + 150 °C
-55 ... + 150
125
K/W
E
55 / 150 / 56
Electrical Characteristics, at Tj = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
Static Characteristics
Drain- source breakdown voltage
V(BR)DSS
VGS = 0 V, ID = 0.25 mA, Tj = 25 °C
240
-
Gate threshold voltage
VGS(th)
VGS=VDS, ID = 1 mA
0.6
0.8
Zero gate voltage drain current
IDSS
VDS = 240 V, VGS = 0 V, Tj = 25 °C
-
0.1
VDS = 240 V, VGS = 0 V, Tj = 125 °C
-
10
VDS = 100 V, VGS = 0 V, Tj = 25 °C
-
-
Gate-source leakage current
IGSS
VGS = 20 V, VDS = 0 V
-
10
Drain-Source on-state resistance
RDS(on)
VGS = 4.5 V, ID = 0.25 A
-
5
VGS = 1.8 V, ID = 14 mA
-
7
V
-
1.2
1
µA
100
100
nA
nA
100
8
15
Semiconductor Group
2
12/05/1997

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