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BT1308W 查看數據表(PDF) - NXP Semiconductors.

零件编号
产品描述 (功能)
生产厂家
BT1308W
NXP
NXP Semiconductors. NXP
BT1308W Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
NXP Semiconductors
8. Mounting
BT1308W series D
Triacs logic level
3.8 min
1.5
min
1.5
min
(3×)
1.5
min
All dimensions are in mm.
Fig 13. Minimum footprint SOT223
6.3
2.3
4.6
001aab508
36
18
60
4.6
4.5
9
10
7
15
50
001aab509
All dimensions are in mm.
Printed circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 µm thick).
Fig 14. Printed circuit board pad area SOT223
BT1308W_SER_D_1
Product data sheet
Rev. 01 — 27 February 2008
© NXP B.V. 2008. All rights reserved.
10 of 13

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