BTS6144B 查看數據表（PDF） - Infineon Technologies
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BTS6144B Datasheet PDF : 16 Pages
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Data sheet BTS 6144B/P
Thermal Characteristics
Parameter and Conditions
Symbol
Thermal resistance
chip - case: RthJC 5)
junction - ambient (free air): RthJA
SMD version, device on PCB 6):
Values
Unit
min typ max
-- 0.7 0.8 K/W
-- 60
--
-- 33 40
Electrical Characteristics
Parameter and Conditions
at Tj= 25, Vbb = 12 V unless otherwise specified
Symbol
Values
Unit
min typ max
Load Switching Capabilities and Characteristics
On-state resistance (pin 3 to pin 1,2,6,7)
VIN= 0, Vbb= 5.5V, IL = 10 A
Tj=25 °C:
Tj=150 °C:
VIN= 0, Vbb= 12V, IL = 10 A
Tj=25 °C:
Tj=150 °C:
Output voltage drop limitation at small load
currents (Tab to pin 1,2,6,7)
Tj=-40...150 °C:
Nominal load current (Tab to pin 1,5)
ISO Proposal: VON ≤ 0.5 V, TC = 85°C, Tj ≤ 150°C
SMD 6), VON ≤ 0.5 V, TA = 85°C, Tj ≤ 150°C
Turn-on time
to 90% VOUT:
Turn-off time
RL = 2.2 Ω, Tj=-40...150 °C
to 10% VOUT:
Slew rate on
25 to 50% VOUT, RL = 2.2 Ω, Tj=-40...150 °C
Slew rate off
50 to 25% VOUT, RL = 2.2 Ω, Tj=-40...150 °C
RON
VON(NL)
IL(ISO)
IL(nom)
ton
toff
dV /dton
-dV/dtoff
-- 9.5
-- 17
--
7
-- 13
-- 30
13 mΩ
22
9
16
60 mV
37.5 48
-- A
9.5 12
--
-- 300 550 µs
-- 300 600
-- 0.2 0.35 V/µs
-- 0.2 0.45 V/µs
5) Thermal resistance RthCH case to heatsink (about 0.5 ... 0.9 K/W with silicone paste) not included!
6) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb
connection. PCB is vertical without blown air.
Infineon Technologies AG
Page 3 of 16
2003-Oct-01
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