BYW81G 查看數據表（PDF） - STMicroelectronics
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BYW81G Datasheet PDF : 6 Pages
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BYW81P-200 / BYW81PI-200 / BYW81G-200
PACKAGE MECHANICAL DATA
D2PAK (Plastic)
L2
L
L3
A
E
C2
D
A1
B2
B
G
C
R
A2
M*
V2
* FLAT ZONE NO LESS THAN 2mm
s Cooling method: by conduction (method C)
FOOT PRINT DIMENSIONS (in millimeters)
D²PAK
REF.
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
M
R
V2
DIMENSIONS
Millimeters
Inches
Min. Max.
4.40 4.60
2.49 2.69
0.03 0.23
0.70 0.93
1.14 1.70
0.45 0.60
1.23 1.36
8.95 9.35
10.00 10.40
4.88 5.28
15.00 15.85
1.27 1.40
1.40 1.75
2.40 3.20
0.40 typ.
0°
8°
Min. Max.
0.173 0.181
0.098 0.106
0.001 0.009
0.027 0.037
0.045 0.067
0.017 0.024
0.048 0.054
0.352 0.368
0.393 0.409
0.192 0.208
0.590 0.624
0.050 0.055
0.055 0.069
0.094 0.126
0.016 typ.
0°
8°
16.90
10.30
8.90
5.08
1.30
3.70
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
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© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
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