PKFC12C-LF-T75-1 查看數據表（PDF） - ProTek Devices.
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PKFC12C-LF-T75-1 Datasheet PDF : 7 Pages
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Only One Name Means ProTek’Tion™
250w encapsulated flip chip tvs array
PKFC3.3C - PKFC36C
Description
The PKFCxxC series encapsulated flip chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electro-
static Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4
requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the PKF-
CxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually
eliminates overshoot voltage due to package inductance.
Features
• Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
• Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
• Chip Scale Package 0.050” x 0.030”
• ESD Protection > 25 kilovolts
• Available in Voltages Ranging from 3.3V to 36V
• 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
• Bidirectional Configuration & Monolithic Structure
• Protection for 1 Line
• RoHS Compliant
• REACH Compliant
Mechanical characteristics
• Encapsulated 0503 Flip Chip
• Approximate Weight: 0.73 milligrams
• Lead-Free Plating
• Solder Reflow Temperature:
• Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
• Flammability Rating UL 94V-0
• 8mm Tape per EIA Standard 481
applications
• Cellular Phones
• MCM Boards
• Wireless Communication Circuits
• IR LEDs
• SMART & PCMCIA Cards
circuit diagram
05180.R7 9/12
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