JANTXV1N5818UR-1 查看數據表（PDF） - Microsemi Corporation
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JANTXV1N5818UR-1 Datasheet PDF : 6 Pages
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1N5818UR-1, 1N5819UR-1, 1N6761UR-1
and CDLL variants
MECHANICAL and PACKAGING
• CASE: Hermetically sealed glass DO-213AB MELF (LL41) package.
• TERMINALS: Tin/lead or RoHS compliant matte-tin finished copper clad steel available (commercial grade only). Solderable per
MIL-STD-750, method 2026.
• MARKING: Cathode band.
• POLARITY: Diode to be operated with the banded end positive with respect to the opposite end for Zener regulation.
• MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) of this device is approximately +6PPM/°C. The
COE of the Mounting Surface System should be selected to provide a suitable match with this device.
• TAPE & REEL optional: Standard per EIA-481-1-A with 12 mm tape. Consult factory for quantities.
• WEIGHT: Approximately 0.05 grams.
• See Package Dimensions on last page.
PART NOMENCLATURE
1N5818UR-1, 1N5819UR-1* and 1N6761UR-1*:
JAN 1N5819 UR -1 (e3)
Reliability Level
JAN = JAN level*
JANTX = JANTX level*
JANTXV = JANTXV level*
JANS = JANS level*
*(applicable only to 1N5819UR-1
and 1N6761UR-1 numbers)
Blank = Commercial grade
JEDEC type number
(see Electrical Characteristics
table)
CDLL6759 – CDLL6761:
Microsemi Designation
Series number
(see Electrical Characteristics
table)
CDLL 6759
(e3)
CDLL1A20 – CDLL1A100:
Microsemi Designation
1 Amp Rating
20 Volt Working Peak
Reverse Voltage (VRWM)
CDLL 1A 20 (e3)
RoHS Compliance
e3 = RoHS compliant (on
commercial grade only)
Blank = non-RoHS compliant
Metallurgically Bonded
MELF Surface Mount
RoHS Compliance
e3 = RoHS compliant
Blank = non-RoHS compliant
RoHS Compliance
e3 = RoHS compliant
Blank = non-RoHS compliant
T4-LDS-0301-1, Rev. 1 (6/25/13)
©2013 Microsemi Corporation
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