CF5011AND 查看數據表（PDF） - Nippon Precision Circuits
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CF5011AND Datasheet PDF : 7 Pages
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PAD LAYOUT
(Unit:µm)
CF5011 series
VDD
Q (920,1310)
Y
(0,0) INHN XTN
XT VSS
X
Chip size: 0.92 × 1.31 mm
Chip thickness: 300 ± 30 µm
Chip base: VDD level
PIN DESCRIPTION and PAD DIMENSIONS
Name
INHN
XT
XTN
VSS
Q
VDD
Pad dimensions [µm]
I/O
Description
X
Y
Operation mode control input.
<CF5011AL×>
I
The oscillator stops and Q becomes high impedance when LOW. Power saving
pull-up resistor built in
195
212
<CF5011AN×>
Q becomes high impedance when LOW. Pull-up resistor built in
I
Amplifier input
O
Amplifier output
Crystal oscillator connection pins.
Crystal oscillator connected between XT and XTN
385
212
575
212
–
Ground
766
212
O
Output. Output frequency (fO). High impedance when INHN is LOW
–
Supply voltage
765
1152
162
1152
BLOCK DIAGRAM
CF5011AL×
CF5011AN×
VDD VSS
VDD VSS
XTN
CG
CD
Rf 1 Cf
XTN
CG
Rf 2
CD
Rf 1 Cf
XT
Q
XT
Q
Rf 2
INHN
Substrate potential: VDD
INHN
Substrate potential: VDD
NIPPON PRECISION CIRCUITS INC.—2
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