CF5019ALE 查看數據表（PDF） - Nippon Precision Circuits

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CF5019ALE

High-Frequency, 3rd Overtone Crystal Oscillator Module ICs

Nippon Precision Circuits  

PAD LAYOUT

(Unit: µm)

CF5019 series

VDD

(900,1050)

Q

Y

NPC

INHN

VSS

(0,0)

XT XTN

X

Chip size: 0.9 × 1.05mm

Chip thickness: 220µm ± 30µm

PAD size: 90µm

Chip base: VDD level

PIN DESCRIPTION and PAD DIMENSIONS

Name

INHN

XT

XTN

VSS

Q

VDD

I/O

Description

I

Output state control input. High impedance when LOW (oscillator stops).

Power-saving pull-up resistor built-in.

I

Amplifier input

O

Amplifier output

Crystal connection pins.

Crystal is connected between XT and XTN.

–

(–) ground

O

Output

–

(+) supply voltage

BLOCK DIAGRAM

XTN

CG

VDD VSS

CD

Rf 1

Cf

RD

XT

Rf 2

Pad dimensions [µm]

X

Y

144.6

190.6

347.8

560.6

755.4

755.4

151.4

171

171

497.8

905.4

918.2

Q

INHN

INHN = LOW active

SEIKO NPC CORPORATION —2

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