CGY2014 查看數據表（PDF） - Philips Electronics
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CGY2014 Datasheet PDF : 12 Pages
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Philips Semiconductors
GSM/DCS/PCS power amplifier
Preliminary specification
CGY2014ATW
PACKAGE OUTLINE
HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm
SOT527-1
D
c
y
heathsink side
Z
Dh
20
11
E
A
X
HE
vM A
Eh
pin 1 index
1
e
10
wM
bp
A2
A1
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) Dh E(2) Eh
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.10
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.20
0.09
6.6
6.4
4.3
4.1
4.5
4.3
3.1
2.9
0.65
6.6
6.2
1.0
0.75
0.50
0.2
0.13
0.1
0.5
0.2
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT527-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
99-11-12
00-07-12
2000 Nov 28
8
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