18-24GHz Medium Power Amplifier
Chip Assembly and Mechanical Data
CHA5290
To Vd1,2,3 DC Drain supply feed
10nF
To Vd4 DC Drain supply feed
10nF
120pF 120pF 120pF
120pF
120pF
120pF 120pF
120pF
10nF
To Vg1,2,3,4 DC Gate supply
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is to be prefered.
Bonding pad positions.
( Chip thickness : 50µm. All dimensions are in micrometers )
Ref. DSCHA52902295 -22-Oct.-02
5/6
Specifications subject to change without notice
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