CM1230 查看數據表（PDF） - California Micro Devices Corp

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产品描述 (功能)

生产厂家

CM1230

2, 4 and 8-Channel Low Capacitance ESD Protection Array

California Micro Devices Corp 

PRELIMINARY

CM1230

Mechanical Details (cont’d)

CSP-10 Mechanical Specifications

The CM1230-08CS/CP is supplied in a 10 bump Chip

Scale Package (CSP). Dimensions are shown below.

For complete information on the CSP, see the Califor-

nia Micro Devices CSP Package Information docu-

ment.

PACKAGE DIMENSIONS

Package

Custom CSP

Bumps

10

Millimeters

Inches

Dim

Min Nom Max Min Nom Max

A1 0.915 0.960 1.005 0.0360 0.0378 0.0396

A2 2.415 2.460 2.505 0.0951 0.0969 0.0986

B1 0.495 0.500 0.505 0.0195 0.0197 0.0199

B2 0.495 0.500 0.505 0.0195 0.0197 0.0199

C1 0.180 0.230 0.280 0.0071 0.0091 0.0110

C2 0.180 0.230 0.280 0.0071 0.0091 0.0110

D1 0.575 0.644 0.714 0.0226 0.0254 0.0281

D2 0.368 0.419 0.470 0.0145 0.0165 0.0185

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Mechanical Package Diagrams

BOTTOM VIEW

A1

C1

B1

OptiGuardTM

Coating

5

4

3

2 BA

1

BA

D1

0.30 DIA.

D2

63/37 Sn/Pb (Eutectic) or

95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)

SOLDER BUMPS

SIDE

VIEW

NOTE: DIMENSIONS IN MILLIMETERS

Package Dimensions for

CM1230-08 Chip Scale Package

© 2006 California Micro Devices Corp. All rights reserved.

10

490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06

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