CM1224-04MR 查看數據表（PDF） - ON Semiconductor
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CM1224-04MR Datasheet PDF : 11 Pages
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CM1224
PACKAGE DIMENSIONS
SOT−23, 6 Lead
CASE 527AJ
ISSUE B
D
A
B
6
5
4
E
E1
1
2
3
L2
GAGE
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C IS THE SEATING PLANE.
MILLIMETERS
DIM MIN MAX
A --- 1.45
A1 0.00 0.15
e
TOP VIEW
6X b
0.20 M C A S B S
L
DETAIL A
SEATING
PLANE
A2 0.90 1.30
b 0.20 0.50
c 0.08 0.26
D 2.70 3.00
E 2.50 3.10
E1 1.30 1.80
e
0.95 BSC
A2
L 0.20 0.60
L2 0.25 BSC
A
c
6X 0.10 C
A1
SIDE VIEW
C
SEATING
PLANE
DETAIL A
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
3.30
6X
0.85
6X 0.56
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
9
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