CM1230(2010) 查看數據表（PDF） - ON Semiconductor

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产品描述 (功能)

生产厂家

CM1230
(Rev.:2010)

2, 4, and 8-Channel Low-Capacitance ESD Protection Array

ON Semiconductor 

CM1230

Mechanical Details (cont’d)

CSP-4 Mechanical Specifications (CM1230-J2CP)

The CM1230-J2CP is supplied in a 4 bump Chip Scale Package (CSP). Dimensions are shown below. For

complete information on the CSP, see the California Micro Devices CSP Package Information document.

PACKAGE DIMENSIONS

Package

Bumps

Custom CSP

4

Millimeters

Dim

Inches

Min Nom Max Min Nom Max

A1 0.915 0.960 1.005 0.0360 0.0378 0.0396

A2 0.915 0.960 1.005 0.0360 0.0378 0.0396

B1 0.495 0.500 0.505 0.0195 0.0197 0.0199

B2 0.495 0.500 0.505 0.0195 0.0197 0.0199

C1 0.180 0.230 0.280 0.0071 0.0091 0.0110

C2 0.180 0.230 0.280 0.0071 0.0091 0.0110

D1 0.575 0.644 0.714 0.0226 0.0254 0.0281

D2 0.368 0.419 0.470 0.0145 0.0165 0.0185

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Package Dimensions for

CM1230-J2CP Chip Scale Package

Rev. 3 | Page 11 of 16 | www.onsemi.com

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