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CM1230-02(2010) 查看數據表(PDF) - ON Semiconductor

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CM1230-02
(Rev.:2010)
ON-Semiconductor
ON Semiconductor ON-Semiconductor
CM1230-02 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
2, 4, and 8-Channel Low-Capacitance
ESD Protection Array
CM1230
Features
• Two, four, and eight channels of ESD protection
Provides ESD protection to IEC61000-4-2
Level 4
±8kV contact discharge
±15kV air discharge
• Low loading capacitance of 0.8pF typical
• Minimal capacitance change with temperature
and voltage
• Channel I/O to GND capacitance difference of
0.02pF typical is ideal for differential signals
• Channel I/O to I/O capacitance 0.15pF typical
• Zener diode protects supply rail and eliminates
the need for external by-pass capacitors
• Each I/O pin can withstand over 1000 ESD
strikes*
• Available in 4, 6 and 10 bump Chip Scale
Packages (CSP)
OptiGuardcoated for improved reliability at
assembly
• RoHS-compliant, lead-free version finishing
Applications
• LCD and camera data lines in wireless
handsets that use high-speed serial interfaces.
• I/O port protection for mobile handsets,
notebook computers, DSCs, MP3 players,
PDAs, etc. including USB, 1394 and serial ATA
• Wireless handsets
• Handheld PCs/PDAs
• LCD and camera modules
Product Description
The CM1230 is a family of 2, 4 and 8 channel, very
low capacitance ESD protection diode arrays in a
CSP form factor. It is ideal for protecting systems
with high data and clock rates or for circuits that
need low capacitive loading. Each channel consists
of a pair of ESD diodes that act as clamp diodes to
steer ESD current pulses to either the positive or
negative supply rail. A zener diode is integrated
between the positive and negative supply rails. The
VCC rail is protected from ESD strikes and eliminates
the need for a bypass capacitor to absorb positive
ESD strikes to ground. Each channel can safely
dissipate ESD strikes of ±8kV, meeting the Level 4
requirement of the IEC61000-4-2 international
standard as well as ±15kV air discharges per the
IEC61000-4-2 specification. Using the MIL-STD-
883 (Method 3015) specification for Human Body
Model (HBM) ESD, the pins are protected for
contact discharges at greater than ±15kV.
This device is well-suited for next generation
wireless handsets that implement high-speed serial
interface solutions for the LCD display and camera
interfaces. In these designs, a tolerance above
1.5pF cannot be tolerated when high data rates are
transferred between the baseband choppiest and
the LCD driver/controller Is. Higher capacitive
loading normally causes the rise and fall times to
slow which hampers the functionality of circuit and
operation of the wireless handset. The CM1230
incorporates OptiGuardwhich results in improved
reliability at assembly. The CM1230 is available in a
space-saving, low profile Chip Scale Package with
RoHS-compliant, lead-free finishing.
©2010 SCILLC. All rights reserved.
May 2010 – Rev. 2
Publication Order Number:
CM1230/D

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