CM300425SF 查看數據表（PDF） - California Micro Devices Corp

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CM300425SF

1.0 Amp Dual Mode Low-Dropout CMOS Regulator

California Micro Devices Corp 

Performance Information (cont’d)

CM3004 Typical Thermal Characteristics

The overall junction to ambient thermal resistance

(θJA) for device power dissipation (PD) consists prima-

rily of two paths in series. The first path is the junction

to the case (θJC) which is defined by the package

style, and the second path is case to ambient (θCA)

thermal resistance which is dependent on board lay-

out. The final operating junction temperature for any

set of conditions can be estimated by the following

thermal equation:

TJUNC = TAMB + PD (θJC) + PD (θCA)

= TAMB + PD (θJA)

The CM3004 uses a thermally enhanced package

where all the GND pins (5 through 8) are integral to the

leadframe. When this package is mounted on a double

sided printed circuit board with two square inches of

copper allocated for "heat spreading", the resulting θJA

is about 50°C/W.

Based on a typical operating power dissipation of 1.0W

with an ambient of 85°C, the resulting junction temper-

ature will be:

TJUNC = TAMB + PD (θJA)

= 85°C + 1.0W (50°C/W)

= 85°C + 50°C = 135°C

Thermal characteristics were measured using a double

sided board with two square inches of copper area

connected to the GND pins for "heat spreading". Mea-

surement was performed under light load conditions

(5mA).

PRELIMINARY

CM3004

Tem perature vs. Output Voltage (1.2V)

1.25

1.23

1.21

1.19

1.17

1.15

-40

25

85

Tem perature ('C)

Temperature vs. Output Voltage ( 2.5V )

2.60

2.55

2.50

2.45

2.40

-40 -25 0

25 50 75 85 100 125 150

Tem perature ('C)

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