CPC5710N 查看數據表（PDF） - Clare Inc => IXYS
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CPC5710N Datasheet PDF : 10 Pages
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4. Manufacturing Information
Note that the CPC5710N branding (package
imprinting) leaves off the last character of the part
number, the letter “N,” due to package space
limitations.
CPC5710N
4.1 Mechanical Dimensions
4.1.1 8-Pin SOIC Package
8-Pin SOIC Package
0.19 / 0.25
(0.008 / 0.010)
Recommended PCB Land Pattern
5.80 / 6.20
(0.23 / 0.24)
PIN 1
0.356 / 0.457
(0.014 / 0.018)
4.80 / 4.98
(0.19 / 0.20)
0.53 REF
(0.021 REF)
3.81 / 3.99
(0.15 / 0.16)
0.41 / 1.27
(0.016 / 0.050)
1.27 TYP
(0.05 TYP)
1.37 / 1.58
(0.05 / 0.06)
0.10 / 0.25
(0.004 / 0.010)
1.52 / 1.73
(0.06 / 0.07)
1.55
(0.061)
0.60
(0.024)
5.40
(0.213)
1.27
(0.050)
Dimensions
mm
(inches)
4.1.2 Tape and Reel Specifications
Tape and Reel Packaging for 8-Pin SOIC Package
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossed Carrier
Embossment
Top Cover
Tape
K0= 2.10 ± 0.10
(0.083 ± 0.004)
W = 12.00 ± 0.30
(0.472 ± 0.012)
B
0
=
5.30
±
0.10
(0.209 ± 0.004)
P = 8.00 ± 0.10
(0.315 ± 0.004)
A0 = 6.50 ± 0.10
(0.256 ± 0.004)
User Direction of Feed
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
R02
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