CS8147 查看數據表（PDF） - ON Semiconductor

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CS8147

10 V/5.0 V Low Dropout Dual Regulator with ENABLE

ON Semiconductor 

CS8147

IIN

VIN

Smart

Regulator

Control

Features

IQ

IOUT1

VOUT1

IOUT2

VOUT2

Figure 16. Dual Output Regulator With Key

Performance Parameters Labeled.

Heat Sinks

A heat sink effectively increases the surface area of the

package to improve the flow of heat away from the IC and

into the surrounding air.

Each material in the heat flow path between the IC and the

outside environment will have a thermal resistance. Like

series electrical resistances, these resistances are summed to

determine the value of RΘJA:

RQJA + RQJC ) RQCS ) RQSA

(3)

where:

RΘJC = the junction–to–case thermal resistance,

RΘCS = the case–to–heatsink thermal resistance, and

RΘSA = the heatsink–to–ambient thermal resistance.

RΘJC appears in the package section of the data sheet. Like

RΘJA, it too is a function of package type. RΘCS and RΘSA

are functions of the package type, heatsink and the interface

between them. These values appear in heat sink data sheets

of heat sink manufacturers.

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