CXA1779 查看數據表（PDF） - Sony Semiconductor

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产品描述 (功能)

生产厂家

CXA1779

Predriver for High Resolution Computer Displays

Sony Semiconductor 

Package Outline

Unit: mm

28PIN DIP (PLASTIC)

+ 0.4

37.8 – 0.1

28

15

1

14

2.54

CXA1779P

0° to 15°

0.5 ± 0.1

1.2 ± 0.15

Two kinds of package surface:

1.All mat surface type.

2.Center part is mirror surface.

SONY CODE

EIAJ CODE

JEDEC CODE

DIP-28P-03

DIP028-P-0600

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

COPPER ALLOY

4.2g

– 10 –

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