CXK5T81000ATN 查看數據表（PDF） - Sony Semiconductor
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CXK5T81000ATN Datasheet PDF : 10 Pages
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Package Outline
Unit: mm
CXK5T81000ATN
32PIN TSOP (PLASTIC)
∗8.0 ± 0.1
32
17
1.2 MAX
0.1
1
0.2
0.08 M
16
0.5
A
0.145
+ 0.1
0.05 – 0.05
0° to 10°
NOTE: Dimension “∗” does not include mold protrusion.
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP-32P-L02
TSOP032-P-0813.4-C
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42 ALLOY
0.2g
CXK5T81000AYN
32PIN TSOP (PLASTIC)
∗8.0 ± 0.1
17
32
1.2 MAX
0.1
16
0.2
0.08 M
1
0.5
A
0.145
+ 0.1
0.05 – 0.05
0° to 10°
NOTE: Dimension “∗” does not include mold protrusion.
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP-32P-L02R
TSOP032-P-0813.4-D
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42 ALLOY
0.2g
CXK5T81000ATN/AYN
– 10 –
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