CXK77B3611AGB 查看數據表（PDF） - Sony Semiconductor

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产品描述 (功能)

生产厂家

CXK77B3611AGB

High Speed Bi-CMOS Synchronous Static RAM

Sony Semiconductor 

Package Outline

Unit: mm

119 TERMINAL BGA (PLASTIC)

CXK77B3611AGB

3-C1.0

14.0

11.5

4-C0.6

×4

0.10

0.6 ± 0.1

A

B

X

C

7.62

3.19 1.27

U

T

R

P

N

M

L

0.35 C

K

J

H

G

F

E

D

C

B

A

C1.5

1234567

0.6 ± 0.1

1.5

φ0.75 ± 0.15

φ0.3 C A B

φ0.1

0.15 C

DETAIL X

SONY CODE

EIAJ CODE

JEDEC CODE

BGA-119P-01

PACKAGE STRUCTURE

PACKAGE MATERIAL

BOARD MATERIAL

TERMINAL MATERIAL

PACKAGE WEIGHT

EPOXY RESIN

COPPER-CLAD LAMINATE

SOLDER

0.8g

–4–

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