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CY62256LL-55SNE 查看數據表(PDF) - Cypress Semiconductor

零件编号
产品描述 (功能)
生产厂家
CY62256LL-55SNE
Cypress
Cypress Semiconductor Cypress
CY62256LL-55SNE Datasheet PDF : 12 Pages
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CY62256
Thermal Resistance
Description
Thermal Resistance
(Junction to Ambient)[5]
Thermal Resistance
(Junction to Case)[5]
Test Conditions
Still Air, soldered on a 4.25 x 1.125
inch, 4-layer printed circuit board
Symbol
ΘJA
ΘJC
DIP
75.61
43.12
SOIC
76.56
36.07
TSOP
93.89
24.64
RTSOP
93.89
24.64
Unit
°C/W
°C/W
AC Test Loads and Waveforms
5V
OUTPUT
100 pF
INCLUDING
JIG AND
SCOPE
R1 1800
R2
990
(a)
R1 1800
5V
OUTPUT
3.0V
5 pF
R2
990
INCLUDING
JIG AND
SCOPE (b)
10%
GND
< 5 ns
Equivalent to:
THÉVENIN EQUIVALENT
ALL INPUT PULSES
90%
90%
10%
< 5 ns
Data Retention Characteristics
OUTPUT
639
1.77V
Parameter
Description
Conditions[6]
Min. Typ.[2] Max. Unit
VDR
ICCDR
VCC for Data Retention
Data Retention Current L
LL
2.0
V
VCC = 3.0V, CE > VCC 0.3V,
VIN > VCC 0.3V, or VIN < 0.3V
2
50
µA
0.1
5
µA
LL - Ind’l
0.1
10
µA
tCDR[5]
tR[5]
LL - Auto
Chip Deselect to Data Retention Time
Operation Recovery Time
0.1
10
µA
0
ns
tRC
ns
Data Retention Waveform
DATA RETENTION MODE
VCC
3.0V
VDR > 2V
3.0V
tCDR
tR
CE
Notes:
6. No input may exceed VCC + 0.5V.
Document #: 38-05248 Rev. *C
Page 4 of 12

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