PCA1676U/10 查看數據表（PDF） - Philips Electronics
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PCA1676U/10 Datasheet PDF : 12 Pages
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Philips Semiconductors
32 kHz watch circuits using a silver-oxide
or a 3 V lithium battery
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
y
OSC OUT
OSC IN
TEST
V SS
Product specification
PCA167x series
1.44 mm
PCA167xU
SERIES
0
0
VDD
M1
2.02 mm
x
M2
RESET
MSA979
Chip area: 2.91 mm2.
Bonding pad dimensions: 110 µm × 110 µm.
Chip thickness: 200 ±25 µm, with bumps: 270 ±25 µm.
Fig.3 Bonding pad locations, PCA167xU series; 8 terminals.
Table 1 Bonding pad locations (dimensions in µm)
All x/y coordinates are referenced to the centre of pad (VDD), see Fig.3.
PAD
x
VSS
TEST
OSC IN
OSC OUT
VDD
M1
M2
RESET
chip corner (max. value)
1 290
940
481
−102
0
578
930
1 290
−497.5
y
1 100
1 100
1 100
1 100
0
0
0
0
−170
1998 Apr 03
6
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