80960CF-40(2002) 查看數據表（PDF） - Intel
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80960CF-40 Datasheet PDF : 70 Pages
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80960-40, -33, -25
Table 11. 80960CF PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
200 400 600
800 1000
(0) (1.01) (2.03) (3.07) (4.06) (5.07)
θ Junction-to-Case
(Case measured as
1.5 1.5
1.5
1.5
1.5
1.5
shown in Figure 5.)
θJA
θJC
θ Case-to-Ambient
(No Heatsink)
17
14
11
9
7.1
6.6
θ Case-to-Ambient
(With Heatsink)
13
9
5.5
5
3.9
3.4
(See Note 3.)
NOTES:
1. This table applies to 80960CF PGA plugged into socket or soldered directly to board.
2. θJA = θJC + θCA
3. 0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Table 12. 80960CF PQFP Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
50
100
200
400
(0) (0.25) (0.50) (1.01) (2.03)
θ Junction-to-Case (Case Measured
as shown in Figure 5.)
5
5
5
5
5
θ Case-to-Ambient (No Heatsink)
19
18
17
15
12
NOTES:
1. This table applies to 80960CF PQFP soldered directly to board.
2. θJA = θJC + θCA
600
(3.04)
5
10
θJC
800
(4.06)
5
9
3.5
Stepping Register Information
Upon reset, register g0 contains die stepping information (see Figure 6). The most significant byte
contains ASCII 0; the upper middle byte contains an ASCII C; the lower middle byte contains an
ASCII F. The least significant byte contains the stepping number in ASCII, and g0 retains this
information until it is overwritten by the user program. Table 13 contains a cross reference of the
number in the least significant byte of register g0 to the die stepping number.
24
Datasheet
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