80960CF-40(2002) 查看數據表（PDF） - Intel
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80960CF-40 Datasheet PDF : 70 Pages
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80960-40, -33, -25
4.3
Recommended Connections
Power and ground connections must be made to multiple VCC and VSS (GND) pins. Every
80960CF-based circuit board should include power (VCC) and ground (VSS) planes for power
distribution. Every VCC pin must be connected to the power plane, and every VSS pin must be
connected to the ground plane. Pins identified as ‘NC’ must not be connected in the system.
Liberal decoupling capacitance should be placed near the 80960CF. The processor may cause
transient power surges when its numerous output buffers transition, particularly when connected to
large capacitive loads.
Low inductance capacitors and interconnects are recommended for best high frequency electrical
performance. Inductance may be reduced by shortening the board traces between the processor and
decoupling capacitors as much as possible. Capacitors specifically designed for PGA packages
may offer the lowest possible inductance.
For reliable operation, always connect unused inputs to an appropriate signal level. In particular,
any unused interrupt (XINT, NMI), DMA (DREQ), or BTERM input should be connected to VCC
through a pull-up resistor. Pull-up resistors should be in the in the range of 20 KW for each pin tied
high. When READY or HOLD are not used, the unused input should be connected to ground. N.C.
pins must always remain unconnected. For additional information refer to the i960® CA/CF
Microprocessor User’s Manual (order number 270710).
4.4
D.C. Specifications
Table 16 presents the D.C. specifications of the 80960CF.
Datasheet
27
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