D2570H881 查看數據表（PDF） - Agere -> LSI Corporation

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D2570H881

D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module

Agere -> LSI Corporation 

Data Sheet, Rev. 3

July 2001

D2570, D2526G, D2555 Wavelength-Selected

Direct Modulated Isolated DFB Laser Module

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-

lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess

of those given in the performance characteristics of the data sheet. Exposure to absolute maximum ratings for

extended periods can adversely affect device reliability.

Parameter

Symbol

Min

Laser Reverse Voltage

VRLMAX

—

dc Forward Current

IFLMAX

—

Operating Case Temperature Range

TC

–40

Storage Case Temperature Range*

Tstg

–40

Photodiode Reverse Voltage

VRPDMAX

—

Photodiode Forward Current

IFPDMAX

—

* Does not apply to shipping container.

Max

2

150

70

85

10

2

Unit

V

mA

°C

°C

V

mA

Handling Precautions

Mounting Instructions

Power Sequencing

To avoid the possibility of damage to the laser module

from power supply switching transients, follow this turn-

on sequence:

1. All ground connections

2. Most negative supply

3. Most positive supply

4. All remaining connections

Reverse the order for the proper turn-off sequence.

Electrostatic Discharge

CAUTION:

This device is susceptible to damage

as a result of electrostatic discharge.

Take proper precautions during both

handling and testing. Follow guide-

lines such as JEDEC Publication No.

108-A (Dec. 1988).

Agere Systems employs a human-body model (HBM)

for ESD-susceptibility testing and protection-design

evaluation. ESD voltage thresholds are dependent on

the critical parameters used to define the model. A

standard HBM (resistance = 1.5 k¾, capacitance =

100 pF) is widely used and, therefore, can be used for

comparison purposes. The HBM ESD threshold pre-

sented here was obtained using these circuit parame-

ters:

Parameter

Human-body Model

Value

>400

Unit

V

Agere Systems Inc.

The minimum fiber bend radius is 1.23 in (31.25 mm).

To avoid degradation in performance, mount the mod-

ule on the board as follows:

1. Place the bottom flange of the module on a flat heat

sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in

size. The surface finish of the heat sink should be

better than 32 µin. (0.8 µm), and the surface flatness

must be better than 0.001 in. (25.4 µm). Using ther-

mal conductive grease is optional; however, thermal

performance can be improved by up to 5% if con-

ductive grease is applied between the bottom flange

and the heat sink.

2. Mount four #2-56 screws with Fillister heads

(M2-3 mm) at the four screw hole locations (see

Outline Diagram). The Fillister head diameter must

not exceed 0.140 in. (3.55 mm). Do not apply more

than 1 in./lb. of torque to the screws.

0.062 (1.58)

0.031 (0.79)

0.140

(3.56)

0.118

(3.00)

0.086

(2.18)

0.129 (3.28) R

0.041 (1.04)

1-532

Note: Dimensions are in inches and (millimeters).

Figure 2. Fillister Head Screw

3

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