DS1646/DS1646P
DS1646P
TOP VIEW
SIDE VIEW
PKG
DIM
A
B
C
D
E
F
G
INCHES
MIN
0.920
0.980
–
0.052
0.048
0.015
0.025
NOM
0.925
0.985
–
0.055
0.050
0.020
0.027
MAX
0.930
0.990
0.080
0.058
0.052
0.025
0.030
BOTTOM VIEW
NOTE: For the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“live – bug”).
b. Hand Soldering and touch – up: Do not touch or apply the soldering iron to leads for more than 3 (three)
seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part,
apply flux, heat the lead frame pad until the solder reflows and use a solder wick to remove solder.
031698 10/12