DS1646 查看數據表（PDF） - Dallas Semiconductor -> Maxim Integrated
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DS1646 Datasheet PDF : 12 Pages
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DS1646/DS1646P
NOTES:
1. All voltages are referenced to ground.
2. Typical values are at 25°C and nominal supplies.
3. Outputs are open.
4. Data retention time is at 25°C and is calculated from
the date code on the device package. The date code
XXYY is the year followed by the week of the year
in which the device was manufactured. For exam-
ple, 9225, would mean the 25th week of 1992.
5. tAH1, tDH1 are measured from WE going high.
6. tAH2, tDH2 are measured from CE going high.
OUTPUT LOAD
D.U.T.
1KΩ
+5 VOLTS
1.8KΩ
100 pF
7. Real–Time Clock Modules (DIP) can be successfully processed through conventional wave–soldering tech-
niques as long as temperature exposure to the lithium energy source contained within does not exceed +85°C.
Post solder cleaning with water washing techniques is acceptable, provided that ultrasonic vibration is not used.
In addition, for the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“live – bug”).
b. Hand Soldering and touch – up: Do not touch or apply the soldering iron to leads for more than 3 (three)
seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part,
apply flux, heat the lead frame pad until the solder reflows and use a solder wick to remove solder.
DS1646 32–PIN PACKAGE
1
D
A
C
F
K
G
J
E
H
B
PKG
DIM
A IN.
MM
B IN.
MM
C IN.
MM
D IN.
MM
E IN.
MM
F IN.
MM
G IN.
MM
H IN.
MM
J IN.
MM
K IN.
MM
32–PIN
MIN
MAX
1.670
38.42
1.690
38.93
0.715
18.16
0.740
18.80
0.335
8.51
0.365
9.27
0.075
1.91
0.105
0.67
0.015
0.38
0.030
0.76
0.140
3.56
0.180
4.57
0.090
2.29
0.110
2.79
0.590
14.99
0.630
16.00
0.010
0.25
0.018
0.45
0.015
0.38
0.025
0.64
031698 9/12
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