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DS18S20 查看數據表(PDF) - Dallas Semiconductor -> Maxim Integrated

零件编号
产品描述 (功能)
生产厂家
DS18S20
Dallas
Dallas Semiconductor -> Maxim Integrated Dallas
DS18S20 Datasheet PDF : 27 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
1-WIRE CRC CODE Figure 6
(MSB)
XOR
XOR
(LSB)
DS18S20
INPUT
XOR
MEMORY
The DS18S20’s memory is organized as shown in Figure 7. The memory consists of a scratchpad RAM
and a nonvolatile, electrically erasable (E2) RAM, which stores the high and low temperature triggers, TH
and TL. The scratchpad helps insure data integrity when communicating over the 1–Wire bus. Data is
first written to the scratchpad where it can be read back. After the data has been verified, a copy
scratchpad command will transfer the data to the nonvolatile (E2) RAM. This process insures data
integrity when modifying the memory. The DS18S20 EEPROM is rated for a minimum of 50,000 writes
and 10 years data retention at T = +55°C.
The scratchpad is organized as 8 bytes of memory. The first 2-bytes contain the measured temperature
information. The third and fourth bytes are volatile copies of TH and TL and are refreshed with every
power–on reset. The next 2 bytes are not used; upon reading back, however, they will appear as all logic
“1s”. The seventh and eighth bytes are count registers, which may be used in obtaining higher
temperature resolution (see “Operation–measuring Temperature” section). There is a ninth byte which
may be read with a Read Scratchpad command. This byte contains a cyclic redundancy check (CRC)
byte which is the CRC over all of the 8 previous bytes. This CRC is implemented in the fashion
described in the section titled “CRC Generation."
DS18S20 MEMORY MAP Figure 7
SCRATCHPAD
TEMPERATURE LSB
BYTE
0
TEMPERATURE MSB 1
E2 RAM
TH/USER BYTE 1
2
TH/USER BYTE 1
TL/USER BYTE 2
3
TL/USER BYTE 2
RESERVED
4
RESERVED
5
COUNT REMAIN
6
COUNT PER °C
7
CRC
8
8 of 27

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