DTC123TE(2016) 查看數據表（PDF） - ON Semiconductor
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DTC123TE Datasheet PDF : 12 Pages
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MUN2238, MMUN2238L, MUN5238, DTC123TE, DTC123TM3, NSBC123TF3
PACKAGE DIMENSIONS
D
3
HE
1
E
2
b
e
A
A1
SC−59
CASE 318D−04
ISSUE H
C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
MILLIMETERS
DIM MIN NOM MAX
A 1.00
1.15
1.30
A1 0.01
0.06
0.10
b
0.35
0.43
0.50
c
0.09
0.14
0.18
D 2.70
2.90
3.10
E 1.30
1.50
1.70
e
1.70
1.90
2.10
L 0.20
0.40
0.60
H E 2.50
2.80
3.00
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
MIN
0.039
0.001
0.014
0.003
0.106
0.051
0.067
0.008
0.099
INCHES
NOM
0.045
0.002
0.017
0.005
0.114
0.059
0.075
0.016
0.110
MAX
0.051
0.004
0.020
0.007
0.122
0.067
0.083
0.024
0.118
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.4
0.094
1.0
0.039
0.8
0.031
ǒ Ǔ SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
7
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