UPC2762TB-E3(1999) 查看數據表（PDF） - NEC => Renesas Technology

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UPC2762TB-E3
(Rev.:1999)

3 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS

NEC => Renesas Technology 

µPC2762TB, µPC2763TB, µPC2771TB

ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD

AMP-2

Top View

IN

→

C

Mounting direction

(Marking is an example for PC2762TB)

OUT

C

VCC

C

COMPONENT LIST

Value

C

1 000 pF

L

Example: 10 nH

Notes

1. 30 × 30 × 0.4 mm double sided copper clad polyimide board.

2. Back side: GND pattern

3. Solder plated on pattern

4.

: Through holes

For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATION OF

SILICON MEDIUM-POWER HIGH-FREQUENCY AMPLIFIER MMIC (P12152E).

Data Sheet P12710EJ2V0DS00

9

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