EL5127 查看數據表（PDF） - Intersil

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EL5127

2.5MHz 4, 8, 10 & 12 Channel Rail-to-Rail Buffers

Intersil 

EL5127, EL5227, EL5327, EL5427

5V

10µs

VS=±5V

TA=25°C

5V

VIN=10VP-P

FIGURE 22. OPERATION WITH RAIL-TO-RAIL INPUT AND

OUTPUT

Short Circuit Current Limit

The EL5127, EL5227, EL5327, and EL5427 will limit the

short circuit current to ±120mA if the output is directly

shorted to the positive or the negative supply. If an output is

shorted indefinitely, the power dissipation could easily

increase such that the device may be damaged. Maximum

reliability is maintained if the output continuous current never

exceeds ±30mA. This limit is set by the design of the internal

metal interconnects.

Output Phase Reversal

The EL5127, EL5227, EL5327, and EL5427 are immune to

phase reversal as long as the input voltage is limited from

VS- -0.5V to VS+ +0.5V. Figure 23 shows a photo of the

output of the device with the input voltage driven beyond the

supply rails. Although the device's output will not change

phase, the input's overvoltage should be avoided. If an input

voltage exceeds supply voltage by more than 0.6V,

electrostatic protection diodes placed in the input stage of

the device begin to conduct and overvoltage damage could

occur.

1V

10µs

VS=±2.5V

TA=25°C

1V

VIN=6VP-P

FIGURE 23. OPERATION WITH BEYOND-THE-RAILS INPUT

Power Dissipation

With the high-output drive capability of the EL5127, EL5227,

EL5327, and EL5427 buffer, it is possible to exceed the

125°C “absolute-maximum junction temperature” under

certain load current conditions. Therefore, it is important to

calculate the maximum junction temperature for the

application to determine if load conditions need to be

modified for the buffer to remain in the safe operating area.

The maximum power dissipation allowed in a package is

determined according to:

PDMAX

=

T----J---M-----A----X-----------T----A----M----A----X--

ΘJA

where:

TJMAX = Maximum junction temperature

TAMAX = Maximum ambient temperature

θJA = Thermal resistance of the package

PDMAX = Maximum power dissipation in the package

The maximum power dissipation actually produced by an IC

is the total quiescent supply current times the total power

supply voltage, plus the power in the IC due to the loads, or:

PDMAX = Σi[VS × ISMAX + (VS+ - VOUTi ) × ILOADi ]

when sourcing, and:

PDMAX = Σi[VS × ISMAX + (VOUTi - VS- ) × ILOADi ]

when sinking.

where:

i = 1 to Total number of buffers

VS = Total supply voltage

ISMAX = Maximum quiescent current per channel

VOUTi = Maximum output voltage of the application

ILOADi = Load current

If we set the two PDMAX equations equal to each other, we

can solve for RLOADi to avoid device overheat. The package

power dissipation curves provide a convenient way to see if

the device will overheat. The maximum safe power

dissipation can be found graphically, based on the package

type and the ambient temperature. By using the previous

equation, it is a simple matter to see if PDMAX exceeds the

device's power derating curves.

Unused Buffers

It is recommended that any unused buffer have the input tied

to the ground plane.

11

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