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EL7563 查看數據表(PDF) - Intersil

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EL7563 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
EL7563
Typical Performance Curves (20 Pin SO Package) (Continued)
NOTE: The 28-Pin HTSSOP Package Offers Improved Performance
VIN=3.3V
1.8
1.6
VO=1.8V
1.4
VO=1.2V
1.2
1
0.8
VO=1V
0.6
0.4
VO=2.5V
0.2
0
0 0.5 1 1.5 2 2.5 3 3.5 4
OUTPUT CURRENT IO (A)
FIGURE 3. EL7563CM CONVERTER POWER LOSS vs IO
1.6
1.4
1.2
VO=2.5V
1
0.8
0.6
VO=1.2V
0.4
0.2
0
0
1
2
3
4
IO (A)
FIGURE 4. EL7563CRE TOTAL CONVERTER POWER LOSS
VO=2.5V
2.505
2.5
VIN=3.6V
2.495
2.49
VIN=3.3V
2.485
2.48
VIN=3V
2.475
2.47
2.465
0.5 1 1.5 2 2.5 3 3.5 4
LOAD CURRENT IO (A)
FIGURE 5. EL7563CM LOAD REGULATION
VO=2.5V
0.6
0.4
VIN=3.3V
0.2
0
VIN=3.6V
-0.2
-0.4
VIN=3V
-0.6
-0.8
0 0.5 1 1.5 2 2.5 3 3.5 4
IO (A)
FIGURE 6. EL7563CRE LOAD REGULATION
TEST CONDITION:
CHIP IN THE CENTER OF COPPER AREA
50
46
WITH NO AIRFLOW
42
38
WITH 100 LFPM AIRFLOW
34
1 OZ. COPPER PCB USED
30
1
1.5
2
2.5
3
3.5
4
PCB COPPER HEAT-SINKING AREA (in2)
FIGURE 7. EL7563CM θJA vs COPPER AREA
CONDITION:
EL7563CRE THERMAL PAD SOLDERED TO 2-LAYER
PCB WITH 0.039” THICKNESS AND 1 OZ. COPPER ON
BOTH SIDES
50
45
40
35
30
25
0
1.5
2
2.5
3
3.5
4
PCB AREA (in2)
FIGURE 8. EL7563CRE THERMAL RESISTANCE vs PCB
AREA - NO AIR FLOW
6
FN7296.2
May 13, 2005

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