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EMIF01-TV01F3 查看數據表(PDF) - STMicroelectronics

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EMIF01-TV01F3 Datasheet PDF : 8 Pages
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EMIF01-TV01F3
Single line IPAD™, EMI filter and ESD protection
Features
EMI symmetrical (I/O) low-pass filter
High efficiency EMI filtering
Lead-free package
400 µm pitch
Very low PCB space occupation: 0.6 mm2
Very thin package: 0.6 mm
High reliability offered by monolithic integration
Reduction of parasitic elements through CSP
integration
Complies with the following standards
IEC 61000-4-2 level 4 on internal and external
pins:
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883F - Method 3015.7 Class 3
Application
TV analog signal in TV_OUT interface
Description
The EMIF01-TV01F3 is a highly integrated array
designed to suppress EMI/RFI noise and provide
impedance matching for mobile phone and
portable applications. The EMIF01-TV01F3 is in a
Flip Chip package to offer space saving and high
RF performance.
This low pass filter includes ESD protection
circuitry which prevents damage to the protected
device when subjected to ESD surges up to
15 kV.
Flip Chip
(4 bumps)
Figure 1. Pin configuration (bump side)
AB
Pin Description
A1 TV OUT internal
A2 GND
1
2
Pin Description
B1 TV OUT external
B2 GND
Figure 2. Device configuration
TV out
Internal
A1
R
TV out
External
B1
GND
GND
May 2011
TM: IPAD is a trademark of STMicroelectronics.
Doc ID 12078 Rev 3
1/8
www.st.com
8

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