ESDA14V2-2BF 查看數據表（PDF） - STMicroelectronics
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ESDA14V2-2BF Datasheet PDF : 9 Pages
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ESDA14V2-2BF3
4
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 14. Package dimensions
400 µm ± 40
185 µm ± 10
255 µm ± 40
605 µm ± 55
770 µm ± 30
Figure 15. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
Figure 16. Marking
Dot
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xxz
y ww
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