ESDA14V2-4BF2(2008) 查看數據表（PDF） - STMicroelectronics

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ESDA14V2-4BF2
(Rev.:2008)

Quad bidirectional Transil™ array for ESD protection

STMicroelectronics 

Package information

ESDA14V2-4BF2

Figure 14. Foot print recommendations Figure 15. Marking

Copper pad Diameter:

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 315 µm copper pad diameter

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

E

xxz

y ww

Figure 16. Flip Chip tape and reel specification

Dot identifying Pin A1 location

4 ± 0.1

Ø 1.5 ± 0.1

1.22

0.73 ± 0.05

All dimensions in mm

4 ± 0.1

User direction of unreeling

6/8

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