ESDA14V2-4BF2 查看數據表（PDF） - STMicroelectronics
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ESDA14V2-4BF2 Datasheet PDF : 7 Pages
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Figure 12: Ordering Information Scheme
ESDA14V2-4BF2
ESDA 14V2 - 4 B Fx
ESD Array
Breakdown Voltage
14V2 = 14.2 Volts min.
Number of line
4 = 4 lines
Type
B = Bidirectional
Package
F = Flip-Chip
x = 2: Leadfree Pitch = 500µm, Bump = 315µm
Figure 13: FLIP-CHIP Package Mechanical Data
700µm ± 50
315µm ± 50
650µm ± 65
1.12 mm ± 50µm
Figure 14: Foot print recommendations
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 15: Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
E
xxz
y ww
5/7
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