ESDALC6V1-5M6 查看數據表（PDF） - STMicroelectronics

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产品描述 (功能)

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ESDALC6V1-5M6

4- and 5-line low capacitance Transil™ arrays for ESD protection

STMicroelectronics 

ESDALC6V1M6, ESDALC6V1-5M6

3

Package information

Package information

● Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Table 3. Package dimensions

D

N

Dimensions

Ref

Millimeters

Inches

E

Min Typ Max Min Typ Max

12

A

A1

12

e

1. ± 0.1 mm

2. ± 0.05 mm

L

k

b

A 0.50 0.55

A1 0.00 0.02

b 0.18 0.25

D(1)

1.45

E(1)

1.00

e(2)

0.50

k 0.20

L 0.30 0.35

0.60

0.05

0.30

0.40

0.020 0.022 0.024

0.000 0.001 0.002

0.007 0.010 0.012

0.057

0.039

0.020

0.008

0.012 0.014 0.016

Figure 13. Footprint dimensions in mm [inches]

0.50

[0.020]

0.25

[0.010]

0.65

[0.026]

0.30 1.60

[0.012] [0.063]

5/11

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