SESD9L5.0ST5G(2012) 查看數據表（PDF） - ON Semiconductor
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SESD9L5.0ST5G Datasheet PDF : 4 Pages
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ESD9L, SESD9L Series
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra−Low
Capacitance
The ESD9L Series is designed to protect voltage sensitive components
that require ultra−low capacitance from ESD and transient voltage
events. Excellent clamping capability, low capacitance, low leakage, and
fast response time, make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs such as USB 2.0 high speed and
antenna line applications.
http://onsemi.com
1
2
PIN 1. CATHODE
2. ANODE
Specification Features:
• Ultra Low Capacitance 0.5 pF
• Low Clamping Voltage
• Small Body Outline Dimensions:
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
• Low Body Height: 0.016″ (0.4 mm)
• Stand−off Voltage: 3.3 V, 5 V
• Low Leakage
• Response Time is Typically < 1.0 ns
• IEC61000−4−2 Level 4 ESD Protection
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• This is a Pb−Free Device
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
±10
kV
±15
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
°PD°
Tstg
TJ
TL
150
mW
−55 to +150 °C
−55 to +150 °C
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
2
1
SOD−923
CASE 514AB
MARKING DIAGRAM
1
XM
2
X = Specific Device Code
M = Date Code
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
ESD9LxxxST5G SOD−923 8000/Tape & Reel
(Pb−Free)
SESD9LxxxST5G SOD−923 8000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2012
1
October, 2012 − Rev. 5
Publication Order Number:
ESD9L/D
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