FCX558 查看數據表（PDF） - Diodes Incorporated.
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FCX558 Datasheet PDF : 7 Pages
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Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Current
Symbol
VCBO
VCEO
VEBO
IC
ICM
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Power Dissipation
Characteristic
Thermal Resistance, Junction to Ambient Air
Thermal Resistance, Junction to Lead
Operating and Storage Temperature Range
(Note 5)
(Note 6)
(Note 7)
(Note 8)
(Note 5)
(Note 6)
(Note 7)
(Note 8)
(Note 9)
Symbol
PD
RθJA
RθJL
TJ, TSTG
Limit
-400
-400
-7
-200
-500
Value
0.7
1
1.5
2
178
125
83
60
22
-65 to +150
FCX558
Unit
V
V
V
mA
mA
Unit
W
°C/W
°C
ESD Ratings (Note 10)
Characteristic
Electrostatic Discharge - Human Body Model
Electrostatic Discharge - Machine Model
Symbol
ESD HBM
ESD MM
Value
4,000
400
Unit JEDEC Class
V
3A
V
C
Notes:
5. For a device mounted with the exposed collector pad on minimum recommended pad layout (MRP) 1oz copper that is on a single-sided
1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady-state.
6. Same as Note 5, except the device is mounted with the exposed collector pad on 15mm x 15mm 1oz copper.
7. Same as Note 5, except the device is mounted with the exposed collector pad on 25mm x 25mm 1oz copper.
8. Same as Note 5, except the device is mounted with the exposed collector pad on 50mm x 50mm 1oz copper.
9. Thermal resistance from junction to solder-point (on the exposed collector pad).
10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
Thermal Characteristics and Derating Information
140.0
120.0
100.0
80.0
60.0
40.0
0
1oz copper
2oz copper
500 1000 1500 2000
Copper Area (sqmm)
2500
3
T =25°C
A
2
1
2oz copper
1oz copper
0
0
500 1000 1500 2000 2500
Copper Area (sqmm)
FCX558
Datasheet Number: DS33059 Rev. 7 - 2
2 of 7
www.diodes.com
April 2017
© Diodes Incorporated
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