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FDC6327C 查看數據表(PDF) - Fairchild Semiconductor

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FDC6327C Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Electrical Characteristics (continued) TA = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Type Min Typ Max Units
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
(Note 2)
N-Channel
VDD = 10 V, ID = 1 A,
VGS = 4.5V, RGEN = 6
P-Channel
VDD = -10 V, ID = -1 A,
VGS = -4.5 V, RGEN = 6
N-Channel
VDS = 10 V, ID = 2.7 A, VGS = 4.5V
P-Channel
VDS = -10 V, ID = -1.9 A,VGS = -4.5V
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
5
15 ns
7
14
9
18 ns
14 25
12 22 ns
14 25
3
9
ns
3
9
3.25 4.5 nC
2.85 4.0
0.65
nC
0.68
0.90
nC
0.65
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
N-Ch
P-Ch
0.8 A
-0.8
VSD
Drain-Source Diode Forward VGS = 0 V, IS = 0.8 A (Note 2)
N-Ch
Voltage
VGS = 0 V, IS = - 0.8 A (Note 2)
P-Ch
0.76 1.2 V
-0.79 -1.2
Notes:
1: RθJA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
RθJC is guaranteed by design while RθJA is determined by the user's board design. Both devices are assumed to be operating and sharing the dissipated heat energy
equally.
a) 130 °C/W when
mounted on a 0.125 in2
pad of 2 oz. copper.
b) 140 °C/W when
mounted on a 0.005 in2
pad of 2 oz. copper.
c) 180 °C/W when
mounted on a 0.0015 in2
pad of 2 oz. copper.
Scale 1 : 1 on letter size paper
2: Pulse Test: Pulse Width 300 µs, Duty Cycle 2.0%
FDC6327C, Rev. E

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