FH26 查看數據表（PDF） - HIROSE ELECTRIC
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FH26 Datasheet PDF : 12 Pages
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The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
FH26 SeriesG0.3mm Contact Pitch, 1mm above the board, Flexible Printed Circuit ZIF Connectors
Part Number
FH26-13S-0.3SHW(**)
FH26-15S-0.3SHW(**)
FH26-17S-0.3SHW(**)
FH26-21S-0.3SHW(**)
FH26-23S-0.3SHW(**)
FH26-25S-0.3SHW(**)
FH26-27S-0.3SHW(**)
FH26-29S-0.3SHW(**)
FH26-31S-0.3SHW(**)
FH26-33S-0.3SHW(**)
FH26-35S-0.3SHW(**)
FH26-37S-0.3SHW(**)
FH26-39S-0.3SHW(**)
FH26-41S-0.3SHW(**)
FH26-45S-0.3SHW(**)
FH26-51S-0.3SHW(**)
FH26-55S-0.3SHW(**)
FH26-57S-0.3SHW(**)
FH26-61S-0.3SHW(**)
FH26-71S-0.3SHW(**)
CL No.
Number of Contacts
G
580-0209-3-**
13
16
580-0218-4-**
15
16
580-0217-1-**
17
16
580-0207-8-**
21
16
580-0203-7-**
23
16
580-0208-0-**
25
16
580-0204-0-**
27
16
580-0216-9-**
29
24
580-0214-3-**
31
24
580-0210-2-**
33
24
580-0205-2-**
35
24
580-0224-7-**
37
24
580-0201-1-**
39
24
580-0206-5-**
41
24
580-0211-5-**
45
24
580-0200-9-**
51
24
580-0221-9-**
55
32
580-0212-8-**
57
32
580-0213-0-**
61
32
580-0202-4-**
71
44
Part Number
CL No.
Number of Contacts
G
FH26W-13S-0.3SHW(**)
580-2401-1-**
13
16
FH26W-15S-0.3SHW(**)
580-2402-4-**
15
16
FH26W-17S-0.3SHW(**)
580-2403-7-**
17
16
FH26W-19S-0.3SHW(**)
580-2437-9-**
19
16
FH26W-21S-0.3SHW(**)
580-2404-0-**
21
16
FH26W-23S-0.3SHW(**)
580-2405-2-**
23
16
FH26W-25S-0.3SHW(**)
580-2406-5-**
25
16
FH26W-27S-0.3SHW(**)
580-2400-9-**
27
16
FH26W-29S-0.3SHW(**)
580-2407-8-**
29
24
FH26W-31S-0.3SHW(**)
580-2408-0-**
31
24
FH26W-33S-0.3SHW(**)
580-2409-3-**
33
24
FH26W-35S-0.3SHW(**)
580-2410-2-**
35
24
FH26W-37S-0.3SHW(**)
580-2411-5-**
37
24
FH26W-39S-0.3SHW(**)
580-2412-8-**
39
24
FH26W-41S-0.3SHW(**)
580-2413-0-**
41
24
FH26W-45S-0.3SHW(**)
580-2414-3-**
45
24
FH26W-51S-0.3SHW(**)
580-2415-6-**
51
24
FH26W-57S-0.3SHW(**)
580-2417-1-**
57
32
FH26W-61S-0.3SHW(**)
580-2418-4-**
61
32
FH26W-71S-0.3SHW(**)
580-2419-7-**
71
44
All dimensions: mm
H
J
K
L
M
----
7.5
5.6
17.4
21.4
----
7.5
6.2
17.4
21.4
----
7.5
6.8
17.4
21.4
----
7.5
8.0
17.4
21.4
----
7.5
8.6
17.4
21.4
----
7.5
9.2
17.4
21.4
----
7.5
9.8
17.4
21.4
----
11.5
10.4
25.4
29.4
----
11.5
11.0
25.4
29.4
----
11.5
11.6
25.4
29.4
----
11.5
12.2
25.4
29.4
----
11.5
12.8
25.4
29.4
----
11.5
13.4
25.4
29.4
----
11.5
14.0
25.4
29.4
----
11.5
15.2
25.4
29.4
----
11.5
17.0
25.4
29.4
28.4
14.2
18.2
33.4
37.4
28.4
14.2
18.8
33.4
37.4
28.4
14.2
20.0
33.4
37.4
40.4
20.2
23.0
45.4
49.4
H
J
K
L
M
----
7.5
5.6
17.4
21.4
----
7.5
6.2
17.4
21.4
----
7.5
6.8
17.4
21.4
----
7.5
7.4
17.4
21.4
----
7.5
8.0
17.4
21.4
----
7.5
8.6
17.4
21.4
----
7.5
9.2
17.4
21.4
----
7.5
9.8
17.4
21.4
----
11.5
10.4
25.4
29.4
----
11.5
11.0
25.4
29.4
----
11.5
11.6
25.4
29.4
----
11.5
12.2
25.4
29.4
----
11.5
12.8
25.4
29.4
----
11.5
13.4
25.4
29.4
----
11.5
14.0
25.4
29.4
----
11.5
15.2
25.4
29.4
----
11.5
17.0
25.4
29.4
28.4
14.2
18.8
33.4
37.4
28.4
14.2
20.0
33.4
37.4
40.4
20.2
23.0
45.4
49.4
IRecommended Temperature Profile
MAX 250ç
250
230ç
200
200ç
150
(ç)
100
150ç
50
25ç (60sec.) 90 sec. to 120 sec.
(60sec.)
0
Start
Preheating
Soldering
60
120
Time (Seconds)
HRS test conditions
Solder method
:Reflow, IR/hot air
Environment
:Room air
Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number: M705-221CM5-32-10.5)
Test board
:Glass epoxy 25mm∞50mm∞0.8mm thick
Land dimensions :0.3mm∞0.65mm, 0.3mm∞0.8mm
Metal mask
:0.23∞0.55∞0.1mm thick,
0.23∞0.65∞0.1mm thick
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
7
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