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MSM63188A 查看數據表(PDF) - Oki Electric Industry

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MSM63188A Datasheet PDF : 33 Pages
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¡ Semiconductor
PAD CONFIGURATION
Pad Layout
MSM63188A
PD.3 124
PD.2 125
PD.1 126
PD.0 127
PC.3 128
PC.2 129
PC.1 130
PC.0 131
PB.3 132
PB.2 133
PB.1 134
PB.0 135
PA.3 136
PA.2 137
PA.1 138
PA.0 139
P9.3 140
P9.2 141
P9.1 142
P9.0 143
P8.3 144
P8.2 145
P8.1 146
P8.0 147
P7.3 148
P7.2 149
P7.1 150
P7.0 151
P6.3 152
P6.2 153
P6.1 154
P6.0 155
P5.3 156
P5.2 157
P5.1 158
P5.0 159
Chip Size
Chip Thickness
Coordinate Origin
Pad Hole Size
Pad Size
Minimum Pad Pitch
: 6.60 mm ¥ 6.60 mm
: 350 mm (typ.)
: Chip center
: 100 mm ¥ 100 mm
: 110 mm ¥ 110 mm
: 140 mm
Note: The chip substrate voltage is VSS.
84 SEG0
83 SEG1
82 SEG2
81 SEG3
80 SEG4
79 SEG5
78 SEG6
77 SEG7
76 SEG8
75 SEG9
74 SEG10
73 SEG11
72 SEG12
71 SEG13
70 SEG14
69 SEG15
68 SEG16
67 SEG17
66 SEG18
65 SEG19
64 SEG20
63 SEG21
62 SEG22
61 SEG23
60 SEG24
59 SEG25
58 SEG26
57 SEG27
56 SEG28
55 SEG29
54 SEG30
53 SEG31
52 SEG32
51 SEG33
50 SEG34
49 SEG35
48 SEG36
47 SEG37
46 SEG38
45 SEG39
44 SEG40
43 SEG41
42 SEG42
41 SEG43
Y
X
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