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GS-R1005 查看數據表(PDF) - STMicroelectronics

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GS-R1005
ST-Microelectronics
STMicroelectronics ST-Microelectronics
GS-R1005 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Figure 3.
Figure 4.
GS-R1005
Thermal characterist ics: how to choose the
heat-sink
Sometimes the GS-R1005 requires an external
heat-sink dependingon both operatingtemperature
conditions and power.
Before entering into calculations details, some ba-
sic concepts will be explained to better understand
the problem.
The thermal resistance between two points is rep-
resented by their temperature difference in front of
a specified dissipated power, and it is expressed in
Degree Centigrade per Watt (°C/W).
For GS-R1005 the thermal resistance case to am-
bient is 7.5°C/W. This means that an internal power
dissipation of 1W will bring the case temperature at
7.5°C above the ambient temperature.
The maximum case temperature, at which the mod-
ule provides 10A, is 75°C (see fig. 6).
Let’s suppose to have a GS-R1005 that delivers a
load current of 10A at an ambient temperature of
40°C.
The dissipated power in this operating condition is
about 10.2W (at typical efficiency of 83%), and the
case temperature of the module will be:
TCase = TAmb + Pd × Rth = 40 + 10.2 × 7.5 = 116.8 °C
This value exceeds the maximum allowed tempera-
ture and an external heat-sink must be added. To
this purpose four holes (see mechanical drawing)
are provided on the metal surface of the module.
To calculate this heat-sink, let’s first determine what
the total thermal resistance should be.
Rth = TCaseMAX Tamb = 75 40 = 3.42°C / W
Pd
10.2
This value is the resulting value of the additional
heatsink thermal resistance.
5/7

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