H11F3.3S 查看數據表（PDF） - Fairchild Semiconductor
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H11F3.3S Datasheet PDF : 10 Pages
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PHOTO FET OPTOCOUPLERS
H11F1 H11F2 H11F3
Package Dimensions (Through Hole)
PIN 1
ID.
0.270 (6.86)
0.240 (6.10)
0.070 (1.78)
0.045 (1.14)
0.350 (8.89)
0.330 (8.38)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.300 (7.62)
TYP
Package Dimensions (0.4” Lead Spacing)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.330 (8.38)
3
2
1
PIN 1
ID.
0.270 (6.86)
0.240 (6.10)
4
5
6
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
0.022 (0.56)
0.016 (0.41)
0.020 (0.51)
MIN
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
0.300 (7.62)
TYP
0.016 (0.40) MIN
0.315 (8.00)
MIN
0.405 (10.30)
MAX
0.016 (0.41)
0.008 (0.20)
Recommended Pad Layout for
Surface Mount Leadform
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.004 (0.10)
MIN
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.400 (10.16)
TYP
NOTE
All dimensions are in inches (millimeters)
0.070 (1.78)
0.060 (1.52)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.030 (0.76)
© 2003 Fairchild Semiconductor Corporation
Page 7 of 10
3/19/03
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